Investigation of Heat Flux Propagation in Heat-Conducting Oxide Substrates with Different Heat Conductivity by the Linear Heat Source Method

Introduction. For controlled thermal management of power electronics devices, an important task is to increase the efficiency of heat removal from active components.
Aim. To introduce a new approach to placing a linear contact-type heat source on the surface of thin samples in order to study the features of propagation of heat fluxes in oxide substrates from materials with different thermal conductivities.
Methods and materials. The paper presents the results of studies of the propagation of heat fluxes in oxide substrates with different thermal conductivity (glassceramic and aluminum oxide ceramic - polycor). To generate the heat flux, a linear heat source was used, for which an electrically conductive carbon fiber was applied.
Results. Thermograms and temperature distribution profiles were obtained at different periods of heating time on the surface of the substrate with a heating element and on its reverse side. It was shown that the placement of the linear heat source, implemented using an electrically conductive carbon filament, on the surface of the studied samples and time monitoring of thermograms from two opposite surfaces of the samples allowed to obtain data for evaluating the thermal properties of oxide substrates. The distribution of the heat flux in a homogeneous material near the generation point had the form of a cone of a heat pipe with a base on the surface with a heat source. The thermal cone for an aluminum oxide ceramic substrate had a larger angle of inclination than that in the case of glassceramic.
Conclusion. The results obtained allowed to propose a method for reduction of thermal resistance of a heatconducting substrate by creating conditions for increasing the area of heat-conducting section.

1. Yeh L. T. Review of Heat Transfer Technologies in Electronic Equipment. J. Electron. Packag. 1995, vol. 117, iss. 4, pp. 333‒339. doi: 10.1115/1.2792113

2. Simons R. E., An-tonetti V. W., Nakayama W., Oktay S. Heat Transfer in Electronic Packages. Microelectronics Packaging Handbook. Boston, Springer, 1997, pp. 314‒403. doi: 10.1007/978-1-4615-4086-1_4

3. Schelling P. K., Shi Li, Kenneth E. G. Managing heat for electronics // Materials Today, 2005, vol. 8, iss. 6, pp. 30‒35. doi: 10.1016/S1369-7021(05)70935-4

4. Gridnev V. N., Mironova Zh. A., Shakhnov V. A. Ensuring quality of configuration of assembly contact sites of the high density switching payment. J. Reliability and quality of complex systems. 2014, vol. 4, no. 8, pp. 19‒25. (In Russ.)

5. Sementsov S. G., Gridnev V. N., Sergeeva N. A. Infrared thermography methods of assessing temperature effect on reliability of electronic equipment. Bulletin of the Bauman Moscow State Technical University. Instrumentation series. 2016, no. 1, pp. 3‒14. doi: 10.18698/0236-3933-2016-1-3-14/ (In Russ.)

6. Dinh H. T., Lushpa N. V., Chernyakova K. V., Vrublevsky I. A. Study of distribution of thermal fluxes in a plate of aluminum with nanoporous aluminum oxide by means of thermal imaging measurements. Rep. Belarusian State University of Informatics and Radioelectronics. 2019, no. 1, pp. 119. (In Russ.)

7. Simin A., Kholodnyak D., Vendik I. Multilayer integrated circuits of ultrahigh frequencies based on ceramics with low annealing temperature. Components and technologies. 2005, no. 5, pp. 190‒196. (In Russ.)

8. Muratova E. N., Moshnikov V. A., Luchinin V. V., Bobkov A. A., Vrublevsky I. A., Chernyakova K. V., Terukov E. I. Heat-conducting aluminum-based boards with a nanostructured layer of Al2O3 for power products electronics. Journal of Technical Physics. 2018, vol. 88, iss. 11, pp. 1678. doi: 10.21883/JTF.2018.11.46629.2480 (In Russ.)

9. Andreev S., Chemyakova K., Tzaneva B., Videkov V., Vrublevsky I. Investigation of the efficiency of the heat dissipa-tion for the heat-conducting circuit boards made of alu-minum with the nanoporous alumina layer. 40th Intern. Spring Seminar on Electronics Technology (ISSE). Sofia, Bulgaria, 10‒14 May 2017, Piscataway, IEEE, 2017, pp. 1‒6. doi: 10.1109/ISSE.2017.8000899

10. Wang Ya., Fu P., Guan Yo., Lu Zh., Wei Yi. Research on modeling of heat source for electron beam welding fusion-solidification zone. Chinese J. of Aeronautics. 2013, vol. 26, iss. 1, pp. 217‒223. doi: 10.1016/j.cja.2012. 12.023

11. Pastor M., Balandraud X., Grèdiac M., Robert J. Applying infrared thermography to study the heating of 2024-T3 aluminium specimens under fatigue loading. Infrared Phys. Technol. 2008, vol. 51, iss. 6, pp. 505‒515. doi: 10.1016/j.infrared.2008.01.001

12. Gerasyutenko V. V., Korablev V. A., Minkin D. A., Sharkov A. V. Diagnostics of thermophysical properties and quality control for devices made of high thermal conductivity materials. Scientific and technical Bulletin of information technologies, mechanics and optics. 2019, vol. 19, no. 1, pp. 82‒86. (In Russ.)

13. Korolkov A. P., Ulyanovskiy A. A., Pechenova N. N. Thermal imaging diagnostics of microelectronic components. Bull. Saint Petersburg University of State Fire Service of Emercom of Russia. 2014, vol. 4, pp. 8‒12. (In Russ.)

14. Usamentiaga R., Venegas P., Guerediaga J., Vega L., Molleda J., Bulnes F. G. Infrared thermography for temperature meas-urement and non-destructive testing. Sensors (Basel). 2014, vol. 14, iss. 7, pp. 12305‒12348. doi: 10.3390/s140712305

15. Vrublevsky I., Chernyakova K., Videkov V., Tuchkovsky A. Improvement of the thermal characteristics of the electric heater in the architecture with aluminum, nanoporous alumina and resistive component of carbon fiber. Nanoscience & Nanotechnology. 2016, no. 1, pp. 1‒2. doi: 10.1016/B978-1-4557-3195-4.00001-1

16. Kim H. T. High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging. doi: 10.5772/intechopen.75798

17. Goswami M., Sarkar A., Sharma B. I., Shrikhande V. K., Kothiyal G. P. Effect of alumina concentration on thermal and structural properties of mas glass and glass-ceramics. J. Therm Anal Calorim. 2004, vol. 78, iss. 3, pp. 699‒705. doi: 10.1007/s10973-005-0435-0

18. Chang Z.D., Ma Z. Effect of Anisotropic Conductive Properties on Heat Transfer and Temperature Distribution of Coatings and Substrates. Key Engineering Materials 2012, vol. 512–515. pp. 1045–1050. doi: 10.4028/www.scientific.net/kem.512-515.1045

19. James B. W., Harrison P. Analysis of the temperature distribution, heat flow and effective thermal conductivity of homogeneous composite materials with anisotropic thermal conductivity. J. of Physics D Applied Physics. 1992, vol. 25, iss. 9, pp. 1298‒1303. doi: 10.1088/0022-3727/25/9/003

20. Kang S., Choi J. Y., Choi S. Mechanism of Heat Transfer through Porous Media of Inorganic Intumescent Coating in Cone Calorimeter Testing. Polymers. 2019, vol. 11, iss. 2, pp. 221. doi: 10.3390/polym11020221