Back-Side Electron-Bombarded Silicon pin-Strip

Introduction. In recent decades, in the field of photoelectronics, special attention has been paid to the development of semiconductor matrix photodetectors. These detectors have become an effective alternative to existing television receiving systems. Among such devices, linear position-sensitive sensors are used in cases where the rapid registration of changes to the environment is required (for instance, high-speed locators for flying vehicles).

Aim. To develop a strip of silicon pin-diodes as part of a hybrid IR-detector for effective registration of photoelectrons with time resolution less than 10 ns, as well as to model the key electro-physical characteristics of the strip.

Materials and methods. In the device under development, the registration of photoelectrons is achieved by the presence of a near-surface field using p ++–p junction formed by diffusion of boron into the silicon with resistivity of 3 kΩ · cm. The pulling field is also formed in the space charge region between p ++ - and n ++ -regions. Diffusion of phosphorus was carried out to create the n ++ -region. Numerical calculations of potential distribution, concentration of free charge carriers and currents were carried out using software for 1D- and 2D-modelling (SimWin and TCAD Synopsys).

Results. 2D-calculation of charge carrier concentration and potential distribution was performed. The study determined the minimum bias for the complete depletion of the i-layer, including that for longitudinal grooves of various depths. The strip was tested as part of a hybrid photoelectric device by irradiating light pulses from IR LED. When the voltage on the diodes was reached –270 V, the duration of the signal front on all channels was 5…9 ns.

Conclusion. For use in IR-hybrid detectors, a strip of 12 silicon pin-diodes was developed with a sensitive element of 24 × 0.2 mm in dimension. The study of pulse characteristics showed that the necessary duration of the front signal on all channels was achieved without thinning thus satisfying the requirements for high-speed position-sensitive sensor of the infrared radiation.

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